Complete Gerber package
Production-ready Gerber files, drill files, and fabrication notes for any PCB manufacturer.
I take your idea from concept to a working, bench-tested prototype, with production-ready board designs that perform as intended, pass EMC, and manufacture reliably.
PCB layout is where circuit design meets physical reality. A well-designed board makes the carefully engineered schematic perform as intended, passes EMC certification, survives environmental stress, and manufactures reliably at scale. Poor layout can turn a good circuit into a product that fails testing, overheats, or cannot be assembled. I design every board for manufacturability from the start, so what leaves the bench is ready for production. This extends to high-speed carrier boards for compute modules such as the NVIDIA Jetson Orin, where PCIe, MIPI CSI, and controlled-impedance routing all have to be right. That reaches from high-speed and signal integrity work, such as a compute-module carrier board for the NVIDIA Jetson Orin with PCIe, MIPI CSI, and DDR, down to clean, manufacturing-ready output that drops straight into JLCPCB or your fab of choice.
Every engagement delivers the files, models, and analysis you need to fabricate, assemble, and integrate the board with confidence.
Production-ready Gerber files, drill files, and fabrication notes for any PCB manufacturer.
Accurate 3D STEP model for mechanical integration and enclosure design.
Detailed assembly documentation including pick-and-place files, stencil data, and assembly notes.
Controlled impedance stackup with material selection and fabrication requirements.
Design for Manufacturing analysis with any required adjustments documented.
For high-speed designs, impedance verification, crosstalk analysis, and timing reports.
For power-dense designs, thermal simulation results and a heat dissipation strategy.
Assembled and tested prototype boards ready for evaluation.
Professional PCB design heads off the manufacturing and performance failures that show up again and again.
Poor grounding, inadequate filtering, or antenna-like traces that cause radiated emissions.
Reflections, crosstalk, or timing failures on high-speed signals.
Hot spots, inadequate copper pour, or poor thermal via placement.
Tombstoning, solder bridging, or assembly issues from poor pad design.
Incorrect trace widths or stackup causing high-speed signal degradation.
Voltage drops, ground bounce, or inadequate decoupling affecting circuit performance.
I define the board outline, layer stackup, and critical placement constraints, and establish design rules based on fabrication capabilities and performance requirements.
Strategic placement that optimizes signal flow, thermal management, and mechanical fit. I position the critical components first, then systematically place the supporting circuitry.
Careful routing with attention to signal integrity, power distribution, and EMC. High-speed signals are routed with controlled impedance, differential pairs matched, and sensitive signals isolated.
Comprehensive design rule checks, signal integrity simulation for high-speed nets, and thermal analysis for power components. A DFM review confirms manufacturability.
Board fabrication with trusted manufacturers, component sourcing, and prototype assembly. In-house testing verifies functionality before delivery.
An electronics design engineer with 20+ years of professional experience across analog, digital, RF, and power designs, delivered to clients in 15+ countries. Your project is handled by the person who has shipped hardware like it, start to finish.
See the project portfolioEverything from simple single and double layer boards to dense multilayer, HDI, rigid-flex and metal core, including controlled impedance and high-speed routing.
I deliver the full package: design, fabrication-ready files, and assembled, bench-tested prototypes from my own lab, including pick-and-place for the first builds.
Either. I can lay out a schematic you already have, or take the project from concept and specification through to a tested board.
A description of the product, any existing schematic or block diagram, the key parts or platform you have in mind, and the mechanical and environmental constraints. The rest I work out with you.
Yes. NVIDIA Jetson Orin carrier board design is a core strength: high-speed layout for PCIe, MIPI CSI camera, USB, and Ethernet lanes, power sequencing and rails for the module, connector and I/O breakout, and thermal design for the module heat load. You get a manufacturable carrier board ready for your enclosure and production.
Yes. High-speed PCB design with controlled impedance, length matching, and signal integrity analysis is core work, including PCIe, DDR, MIPI CSI, and USB3 on multilayer stackups. This is what a compute-module carrier board, such as an NVIDIA Jetson Orin carrier with its signal integrity budget, actually depends on.
Yes. The design is handed over as a complete, manufacturing-ready package: Gerbers, drill files, a pick-and-place file, and a BOM that drops straight into JLCPCB or your fab and assembler of choice, checked against their capabilities first so there are no surprises at production.
Whether you need a simple two-layer board or a complex HDI design, professional PCB layout ensures your product works the first time and scales to production.
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